#0 (0%) - nextekinc.com
Title: Nextek, Electronics Design and Manufacturing Services
Description: electronic manufacturing services for advanced technology,high density electronic assemblies
Keywords:electronic manufacturing services, high density interconnect, opto electronics assembly, photonics assembly, printed circuit assembly, printed circuit boards, printed circuit board design, design, PCB, routing, thermo compression bonding, emerging technology, plasma cleaning, pb-free, lead-free, pull testing, destructive testing, non-destructive testing, shear testing, high mix, wire bonding, low volume, dam and fill, laser profiling, wedge-bonding,
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glob top, die placement, flip chip, underfill, overmold, BGA, BGA assembly, opto-electronics, opto electronics, component design, DFM, gerber file generation, electrical design, microelectronics assembly, surface mount assembly, chip on board, flip chip assembly, fiber optic assembly, LVSEM, XRAY, X-Ray, SEM, EDS, EDX, SEM/EDS, SEM/EDX, CSAM, SAM, XRF, ionic contamination, metallurgical, cross-section, cross-sections, microscope, PCB cross-section, decap, decapsulation, IC decapsulation, failure analysis, PCB failure analysis, component failure analysis, FTIR, paragon, industrial design, mechanical design, GSE, Ground Support Equipment, Build to Print, Box Build, Prototype Build, SLA, SLS, FDM, Urethane Casting, Plastic Injection Mold, Metal Injection Mold, Sheetmetal, Sheet Metal, Enclosure Development, FEA, Stess Analysis, Thermal Analysis, Motion Analysis, Cable & Harness Design, Cable Design, Harness Design, CNC Tool Path Creation, Mold Design, ProE, ProEngineer, Mechanica, ISDX, Diagram, Pro/Intralink, Pro Intralink(View Less)